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                      首日!第四屆遙感·通信創(chuàng)新大會(huì):以精密制造賦能航天通信未來(lái)


                      2025年6月12日至13日,第四屆遙感·通信創(chuàng)新大會(huì)在長(zhǎng)春盛大啟幕。作為中國(guó)頂尖的快速樣單及批量電路板生產(chǎn)商,深圳市金晟達(dá)電子技術(shù)有限公司(簡(jiǎn)稱“金晟達(dá)電路”)攜其前沿技術(shù)成果與創(chuàng)新解決方案,首次亮相這一商業(yè)航天領(lǐng)域的標(biāo)桿性峰會(huì),與全球行業(yè)精英共探衛(wèi)星通信、航天智造及數(shù)據(jù)應(yīng)用等核心議題。

                      The 4th Remote Sensing & Communication Innovation Conference was grandly launched in Changchun from June 12th to 13th, 2025. As a leading rapid sample and batch circuit board manufacturer in China, Shenzhen Jinshengda Electronic Technology Co., LTD. (referred to as "Jinshengda Circuit") showcased its cutting-edge technological achievements and innovative solutions for the first time at this benchmark summit in the commercial aerospace field, discussing core topics such as satellite communication, aerospace manufacturing, and data application with global industry elites.

                      硬核技術(shù)亮相,助力航天通信升級(jí)

                      Hardcore technology makes its debut, facilitating the upgrade of aerospace communication

                      金晟達(dá)電路深耕電子制造領(lǐng)域14年,以“放心板”和“準(zhǔn)時(shí)交付”為核心競(jìng)爭(zhēng)力,產(chǎn)品廣泛應(yīng)用于通信、醫(yī)療器械、工控、航空軍工等科技領(lǐng)域。此次參會(huì),金晟達(dá)重點(diǎn)展示了其在微波通信、衛(wèi)星通信及雷達(dá)相控陣天線等領(lǐng)域的創(chuàng)新成果:

                      JSDPCB has been deeply engaged in the electronic manufacturing field for 14 years. With "reliable boards" and "on-time delivery" as its core competitiveness, its products are widely used in communication, medical devices, industrial control, aviation and military industries and other technological fields. At this conference, Jinshengda highlighted its innovative achievements in the fields of microwave communication, satellite communication and radar phased array antennas:

                      • 高精度多層板技術(shù) High-precision multi-layer board technology
                        :?jiǎn)稳湛杉庸?80余款快速樣單,其中60%為多層板,月產(chǎn)量達(dá)5000平方米,滿足航天設(shè)備對(duì)高密度、高可靠性的嚴(yán)苛需求。
                      • It can process over 180 rapid sample orders in a single day, among which 60% are multi-layer boards. The monthly output reaches 5,000 square meters, meeting the strict requirements of aerospace equipment for high density and high reliability.
                      • 高頻高速材料應(yīng)用 Application of high-frequency and high-speed materials
                        :采用玻璃纖維與聚苯醚樹脂(PPO)作為絕緣材料,確保電路板在極端環(huán)境下的穩(wěn)定性,適配衛(wèi)星通信、雷達(dá)系統(tǒng)等高頻場(chǎng)景。
                      • Glass fiber and polyphenylene oxide resin (PPO) are used as insulating materials to ensure the stability of the circuit board in extreme environments, making it suitable for high-frequency scenarios such as satellite communication and radar systems.
                      • 定制化解決方案 Customized solutions
                        :為航天客戶提供從電路設(shè)計(jì)到批量生產(chǎn)的全流程服務(wù),助力星座建設(shè)、衛(wèi)星載荷等項(xiàng)目的快速落地。
                      • We provide full-process services from circuit design to mass production for aerospace customers, facilitating the rapid implementation of projects such as constellation construction and satellite payloads.
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                      深度參與行業(yè)對(duì)話,共謀生態(tài)協(xié)同

                      Deeply participate in industry dialogues and jointly explore ecological synergy

                      大會(huì)期間,金晟達(dá)電路與長(zhǎng)光衛(wèi)星、鑫云科技等企業(yè)深入交流,探討航天產(chǎn)業(yè)鏈上下游協(xié)同創(chuàng)新路徑。針對(duì)衛(wèi)星批產(chǎn)設(shè)計(jì)、航天產(chǎn)品質(zhì)量管理等議題,金晟達(dá)分享了其在快速響應(yīng)、柔性制造及品質(zhì)管控方面的經(jīng)驗(yàn),并提出通過(guò)精密電路板技術(shù)優(yōu)化衛(wèi)星通信模塊的集成度與能效。

                      During the conference, Jinshengda Circuit had in-depth exchanges with enterprises such as Changguang Satellite and Xinyun Technology, exploring the path of collaborative innovation in the upstream and downstream of the aerospace industry chain. Jinshengda shared its experience in rapid response, flexible manufacturing and quality control on issues such as satellite batch production design and aerospace product quality management, and proposed to optimize the integration and energy efficiency of satellite communication modules through precision circuit board technology.
                      此外,金晟達(dá)還與多家國(guó)際客戶及科研機(jī)構(gòu)達(dá)成合作意向,計(jì)劃在低空飛行器、AI服務(wù)器等新興領(lǐng)域拓展應(yīng)用場(chǎng)景,推動(dòng)航天技術(shù)向民用市場(chǎng)的滲透。

                      In addition, Jinshengda has reached cooperation intentions with many international clients and research institutions, planning to expand application scenarios in emerging fields such as low-altitude aircraft and AI servers, and promote the penetration of aerospace technology into the civilian market.

                       

                      以創(chuàng)新驅(qū)動(dòng)發(fā)展,踐行“連接世界”使命

                      Drive development through innovation and fulfill the mission of "connecting the world"

                      作為華為、中興的“優(yōu)秀供應(yīng)商”,金晟達(dá)電路始終以技術(shù)創(chuàng)新為引擎,累計(jì)獲得38項(xiàng)專利技術(shù)、11個(gè)注冊(cè)商標(biāo)及3項(xiàng)軟件著作權(quán)。其自主品牌“JSD”已覆蓋美洲、歐洲及亞洲市場(chǎng),成為全球電子產(chǎn)業(yè)鏈中不可或缺的一環(huán)。

                      As an "outstanding supplier" of Huawei and ZTE, JSDPCB has always taken technological innovation as its driving force, and has accumulated 38 patent technologies, 11 registered trademarks and 3 software Copyrights. Its self-owned brand "JSD" has covered the markets of the Americas, Europe and Asia, becoming an indispensable part of the global electronic industry chain.
                      此次參會(huì),金晟達(dá)電路不僅展示了技術(shù)實(shí)力,更傳遞了“與世界同步、與客戶同行、與伙伴共贏”的理念。未來(lái),金晟達(dá)將繼續(xù)深耕航天通信領(lǐng)域,以精密制造賦能衛(wèi)星互聯(lián)網(wǎng)、可復(fù)用火箭等前沿技術(shù),助力中國(guó)商業(yè)航天邁向更高水平。

                      At this conference, Jinshengda Circuit not only demonstrated its technical strength but also conveyed the concept of "keeping pace with the world, walking hand in hand with customers, and achieving win-win results with partners". In the future, Jinshengda will continue to focus on the aerospace communication field, empowering cutting-edge technologies such as satellite Internet and reusable rockets with precision manufacturing, and helping China's commercial aerospace reach a higher level.

                       

                      大會(huì)信息 Conference Information

                      • 時(shí)間 Time
                        :2025年6月12日-13日
                      • 地點(diǎn) Location
                        :長(zhǎng)春國(guó)際會(huì)展中心
                      • 金晟達(dá)展位 JSDPCB booth
                        :A22

                      金晟達(dá)電路誠(chéng)邀各界同仁蒞臨交流,共探航天通信新未來(lái)!

                      Jinshengda Circuit sincerely invites colleagues from all walks of life to visit and exchange, and jointly explore the new future of aerospace communication!